Heat Transfer in a Silicon Chip Surface Mount Package (COMSOL Multiphysics)

The thermal condition for a silicon chip in a surface-mount package placed on a circuit board near a hot voltage regulator is examined in this simulation.
The chip is subjected to heat from the regulator and from heat generated internally.

This tutorial makes use of the Heat Transfer interface from the Heat Transfer Module, specifically the Thin Layer functionality. Because these are thin layers that conduct heat well, they do not need to be defined in 3D. This definition applies to two layers:
1) The interconnect between the chip and the grounded pin.

2) The ground plate that is also thermally connected to the temperature constraint coming from the voltage regulator.

Link to files:
https://drive.google.com/drive/folders/1Vc--tm3B9hYalGsaygRPEVhyuQ2T5L-P?usp=sharing

#cae #comsol #siliconchip #heattransfer