US picking the wrong enemy, could not possibly compete with China and win

American logistics expert reports from China video: US picking the wrong enemy, could not possibly compete with China and win! US Computer chips sanction against China is a complete failure! Why China beating US is winning the chips race: materials, markets, money, and Moore's Law 美國物流專家從中國視訊報導：美國對華計算機晶片製裁徹底失敗! 美國不自量力，找錯對象，美國不可能與中國競爭並獲勝! 將成為終極輸家。為何中國擊敗美國贏得晶片競賽: 材料、市場、資金和摩爾定律.

Huawei and SMIC are quickly catching up to global rivals in advanced semiconductor manufacturing, which is surprising to many industry analysts.

Chinese tech firms enjoy access to China's enormous supply chain advantages, such as in refined silicon, and in wafer manufacturing.

Chinese companies are also the biggest buyers of semiconductor chips. China is simply too big a market for Western companies to lose, and so they are strongly motivated to go around the export bans, or even set up manufacturing and distribution plants in-country and be outside of US and European oversight.

The Chinese central government, a host of local governments, and Chinese companies themselves have invested far over $100 billion in their semiconductor industry in recent years, which is much more than investments made by other countries.

But another feature of today's chip industry is that Moore's Law is reaching the limits of what semiconductor companies can do. Massive investments in capital and time are required to build the next generation of ever-smaller chips.

So companies have turned to "chip packaging" to achieve high productivity gains, using existing chips. Chip Packaging is an area where Chinese companies are already strong, and allows them to employ economies of scale. This plays directly into their industrial strengths.

The timing of the semiconductor chips war, therefore, has been beneficial to China. It has allowed Chinese firms to catch up, and fast.

華為和中芯國際正在先進半導體製造領域迅速追趕全球競爭對手，這令許多產業分析師感到驚訝。

中國科技公司享有中國龐大的供應鏈優勢，例如精煉矽和晶圓製造。

中國企業也是半導體晶片的最大買家。中國對西方公司來說是一個太大的市場，不容失去，因此它們有強烈的動機繞過出口禁令，甚至在國內設立製造和分銷工廠，不受美國和歐洲的監管。

近年來，中國中央政府、許多地方政府以及中國企業本身對半導體產業的投資遠遠超過1,000億美元，遠遠超過其他國家的投資。

但當今晶片產業的另一個特點是，摩爾定律正在達到半導體公司所能做到的極限。 製造下一代更小的晶片需要大量的資金和時間投資。

因此，公司轉向“晶片封裝”，利用現有晶片來實現生產力的高成長。晶片封裝是中國企業已經實力雄厚的領域，可以讓他們利用規模經濟。這直接發揮了他們的工業優勢。

因此，半導體晶片大戰的時機對中國有利。它讓中國企業能夠快速迎頭趕上.