Chip Change

During component replacement on motherboards, technicians commonly use a no-clean or rosin-based flux to clean and prepare solder joints by removing oxidation and improving solder wetting.

Flux is typically applied with a syringe or brush directly to the pads or component leads before reflowing with a soldering iron or hot air station.

The active chemicals in the flux, such as abietic acid in rosin or halide activators in no-clean formulas, help dissolve metal oxides and prevent further oxidation during soldering.

After the joint is formed, excess flux residue—especially from rosin-based types—is cleaned using high-purity isopropyl alcohol and an ESD-safe brush to prevent corrosion or electrical leakage.

In BGA or fine-pitch SMD work, tacky flux gels are preferred for their stability under heat and minimal residue, ensuring both mechanical reliability and signal integrity in high-density circuits.